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Photosensitive Polyimide Market for Semiconductors to Surpass USD 1 Billion by 2031, Fueled by Advanced Lithography and High-Density Chip Design

[Hyderabad 17th, June 2025] — According to Clearview Market Insights, the global market for photosensitive polyimide (PSPI) materials in semiconductors is projected to increase from USD 530 million in 2024 to over USD 1,020 million by 2031, with a CAGR of 9.5%. The shift toward fine-pitch, multi-layer, and high-reliability integrated circuits is driving demand.

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PSPI offers a rare combination of thermal resistance, fine photopatterning, and chemical compatibility, making it a preferred material in advanced semiconductor packaging, logic fabrication, and wafer-level processing. It plays a crucial role in interlayer insulation, passivation, and multilayer redistribution line (RDL) creation.

Photosensitive polyimides are enabling the ultra-fine geometries and stacked structures required for today's most advanced chips," said a CVMI semiconductor analyst. "They’re not just materials—they’re enablers of 3D silicon architecture.

Industry leaders such as Toray, Fujifilm, DuPont, and Hitachi Chemical are improving PSPI resolution, controlling thermal expansion, and integrating with EUV-compatible resists. Applications include logic ICs, DRAM, CMOS sensors, and RF modules, all of which require ultra-clean and reliable dielectric solutions.

Asia-Pacific remains the global production hub for PSPI in semiconductors, while North America and Europe lead in node R&D and specialty semiconductor markets such as automotive and image sensing.

For more insights, visit https://clearviewmarketinsights.com/

About Clearview Market Insights:

Clearview Market Insights is a leading market research and consulting firm providing in-depth industry analysis and strategic recommendations for businesses worldwide.

 

Media contact:

Bhavani K
Marketing and Sales Head
ClearView Market Insights
Mail: 
sales@clearviewmarketinsights.com
Phone: +1 917-993-7369

 

 

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