[Hyderabad 17th, June 2025] — Clearview Market Insights estimates that the global market for photosensitive polyimide (PSPI) in electronic packaging will grow from USD 435 million in 2024 to USD 860 million by 2031, reflecting a CAGR of 10.1%. This surge is driven by the global shift toward advanced packaging technologies, including chiplets, fan-out wafer-level packaging (FOWLP), and 3D...