Photosensitive Polyimide Market for Electronic Packaging Expected...

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Photosensitive Polyimide Market for Electronic Packaging Expected to Reach USD 860 Million by 2031,

2025-06-17 07:12:43 • Views

[Hyderabad 17^th, June 2025] — Clearview Market Insights estimates that the global market for photosensitive polyimide (PSPI) in electronic packaging will grow from USD 435 million in 2024 to USD 860 million by 2031, reflecting a CAGR of 10.1%. This surge is driven by the global shift toward advanced packaging technologies, including chiplets, fan-out wafer-level packaging (FOWLP), and 3D stacked ICs.

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PSPI coatings provide a rare combination of fine-line patternability, thermal resistance, and mechanical flexibility. These properties render them indispensable in the redistribution layers (RDL), passivation films, and insulation layers of next-generation system-in-package (SiP) and high-performance chip packages.

"PSPI is enabling a packaging revolution," said a CVMI packaging analyst. "Whether it’s ultra-thin smartphones, AI servers, or radar-equipped vehicles, the demands placed on packaging materials today require a level of performance that PSPI uniquely delivers."

Leading material suppliers such as Toray, Fujifilm, Hitachi, and DuPont are driving innovation in dielectric tunability, dual-cure PSPI stacks, and fine-pitch capabilities for lines under 10 microns. These advancements enable multi-layer 3D integration and improve yield in complex chip assemblies.

Asia-Pacific remains the dominant market, housing the world's leading packaging foundries and OSATs. Meanwhile, North America is at the forefront of research into hybrid bonding and chiplet system architectures. Europe continues to expand the use of PSPI in RF, automotive, and industrial-grade sensor modules.

As packaging transitions from passive protection to active electrical and thermal management, the role of photosensitive polyimide is poised to expand significantly. Future growth will be propelled by material platforms that provide integration readiness, low-temperature processing, and reliability under extreme conditions.

For more insights, visit https://clearviewmarketinsights.com/

About Clearview Market Insights:

Clearview Market Insights is a leading market research and consulting firm providing in-depth industry analysis and strategic recommendations for businesses worldwide.

Media contact:

Bhavani K
Marketing and Sales Head
ClearView Market Insights
Mail: sales@clearviewmarketinsights.com
Phone: +1 917-993-7369

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Photosensitive Polyimide Market for Electronic Packaging Expected to Reach USD 860 Million by 2031,

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