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  • Vous ĂŞtes un artiste numĂ©rique en quĂŞte d’un outil rĂ©volutionnaire ? DĂ©couvrez Wafer, la nouvelle appli de peinture 3D de Sparseal qui ne coĂ»te que 20 $ sur iPad ! Cet outil propose des fonctionnalitĂ©s habituellement rĂ©servĂ©es Ă  des logiciels de bureau coĂ»teux, comme la peinture multicanal simultanĂ©e.

    C’est comme avoir des peintures de maître dans votre poche, mais sans la nécessité de porter une béret ! Je suis impatient d'explorer les possibilités créatives que cela peut offrir. Qui sait, peut-être que je vais finir par créer le chef-d'œuvre qui éblouira le monde… ou au moins ma grand-mère.

    Êtes-vous prêt à donner vie à vos idées avec Wafer ?

    https://www.cgchannel.com/2026/02/check-out-promising-new-3d-texture-painting-app-wafer/
    #Wafer #ArtNumérique #Peinture3D #Sparseal #Créativité
    🎨 Vous êtes un artiste numérique en quête d’un outil révolutionnaire ? Découvrez Wafer, la nouvelle appli de peinture 3D de Sparseal qui ne coûte que 20 $ sur iPad ! Cet outil propose des fonctionnalités habituellement réservées à des logiciels de bureau coûteux, comme la peinture multicanal simultanée. C’est comme avoir des peintures de maître dans votre poche, mais sans la nécessité de porter une béret ! Je suis impatient d'explorer les possibilités créatives que cela peut offrir. Qui sait, peut-être que je vais finir par créer le chef-d'œuvre qui éblouira le monde… ou au moins ma grand-mère. Êtes-vous prêt à donner vie à vos idées avec Wafer ? 👉 https://www.cgchannel.com/2026/02/check-out-promising-new-3d-texture-painting-app-wafer/ #Wafer #ArtNumérique #Peinture3D #Sparseal #Créativité
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    Check out promising new 3D texture painting app Wafer
    Sparseal's $20 iPad app includes features usually only found in more expensive desktop software, like simultaneous multichannel painting.
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  • ## Introducing Wafer: A Game-Changer in 3D Texture Painting

    The world of digital art is ever-evolving, and as technology progresses, so do the tools available to artists. One of the latest innovations making waves in the art community is **Wafer**, a cutting-edge 3D texture painting app developed by Sparseal. Priced at a mere $20, this iPad app brings professional-grade features to the fingertips of artists, enabling them to create stunning 3D textures that were once only accessible through ex...
    ## Introducing Wafer: A Game-Changer in 3D Texture Painting The world of digital art is ever-evolving, and as technology progresses, so do the tools available to artists. One of the latest innovations making waves in the art community is **Wafer**, a cutting-edge 3D texture painting app developed by Sparseal. Priced at a mere $20, this iPad app brings professional-grade features to the fingertips of artists, enabling them to create stunning 3D textures that were once only accessible through ex...
    Check out promising new 3D texture painting app Wafer
    ## Introducing Wafer: A Game-Changer in 3D Texture Painting The world of digital art is ever-evolving, and as technology progresses, so do the tools available to artists. One of the latest innovations making waves in the art community is **Wafer**, a cutting-edge 3D texture painting app developed by Sparseal. Priced at a mere $20, this iPad app brings professional-grade features to the...
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  • Silicon Carbide (SiC) Substrates for Base Station Market to Reach USD 850 Million by 2034 Amid 5G/6G Infrastructure Boom
    global Silicon Carbide (SiC) Substrates for Base Station Market was valued at USD 347 million in 2024 and is projected to reach USD 850 million by 2034, at a CAGR of 9.4% during the forecast period 2026-2034. Explosive growth trajectory reflects unprecedented 5G small cell deployments and emerging 6G requirements for high-frequency RF power amplification.
    SiC substrates deliver 4-8" semi-insulating wafers with <0.1% micropipe density and 4H polytype purity, enabling GaN-on-SiC power amplifiers achieving 50-100W CW output at 55% PAE across critical n78 3.5GHz and FR2 28GHz bands. Offering 4.5x thermal conductivity versus silicon (370 W/mK).
    Access the complete industry analysis and demand forecasts here: https://semiconductorinsight.com/report/silicon-carbide-sic-substrates-for-base-station-market/
    Silicon Carbide (SiC) Substrates for Base Station Market to Reach USD 850 Million by 2034 Amid 5G/6G Infrastructure Boom global Silicon Carbide (SiC) Substrates for Base Station Market was valued at USD 347 million in 2024 and is projected to reach USD 850 million by 2034, at a CAGR of 9.4% during the forecast period 2026-2034. Explosive growth trajectory reflects unprecedented 5G small cell deployments and emerging 6G requirements for high-frequency RF power amplification. SiC substrates deliver 4-8" semi-insulating wafers with <0.1% micropipe density and 4H polytype purity, enabling GaN-on-SiC power amplifiers achieving 50-100W CW output at 55% PAE across critical n78 3.5GHz and FR2 28GHz bands. Offering 4.5x thermal conductivity versus silicon (370 W/mK). 👉 Access the complete industry analysis and demand forecasts here: https://semiconductorinsight.com/report/silicon-carbide-sic-substrates-for-base-station-market/
    SEMICONDUCTORINSIGHT.COM
    Silicon Carbide (SiC) Substrates for Base Station Market, Emerging Trends, Technological Advancements, and Business Strategies 2025-2032
    Silicon Carbide (SiC) Substrates for Base Station Market size was valued at US$ 347 million in 2024 and is projected to reach US$ 742 million by 2032, at a CAGR of 10.3%
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  • Semiconductor Front-End Equipment Market to Reach USD 175 Billion by 2034 Amid AI Chip and 1nm
    Global Semiconductor Front-End Equipment Market was valued at USD 97,070 million in 2024 and is projected to reach USD 175 billion by 2034, at a CAGR of 6.1% during the forecast period 2026-2034. Massive expansion reflects unprecedented wafer fab construction for A16/1nm logic nodes and HBM4 memory capacity supporting exaflop-scale AI training clusters.
    Front-end equipment encompasses EUV/high-NA lithography scanners delivering 8nm pitch resolution, ALD/CVD deposition achieving 2nm nucleation control, and plasma etch systems patterning 100+ layers across 3D NAND decks exceeding 300 active layers. These USD 200M+ EUV tools plus USD 50M etch/deposition clusters enable 300mm wafer throughput exceeding 200k/month per fab, creating 200M+ transistor/cm² densities for TSMC A16, Intel 14A, and Samsung SF2 production ramps.
    Access the complete industry analysis and demand forecasts here: https://semiconductorinsight.com/report/semiconductor-front-end-equipment-market/
    Semiconductor Front-End Equipment Market to Reach USD 175 Billion by 2034 Amid AI Chip and 1nm Global Semiconductor Front-End Equipment Market was valued at USD 97,070 million in 2024 and is projected to reach USD 175 billion by 2034, at a CAGR of 6.1% during the forecast period 2026-2034. Massive expansion reflects unprecedented wafer fab construction for A16/1nm logic nodes and HBM4 memory capacity supporting exaflop-scale AI training clusters. Front-end equipment encompasses EUV/high-NA lithography scanners delivering 8nm pitch resolution, ALD/CVD deposition achieving 2nm nucleation control, and plasma etch systems patterning 100+ layers across 3D NAND decks exceeding 300 active layers. These USD 200M+ EUV tools plus USD 50M etch/deposition clusters enable 300mm wafer throughput exceeding 200k/month per fab, creating 200M+ transistor/cm² densities for TSMC A16, Intel 14A, and Samsung SF2 production ramps. 👉 Access the complete industry analysis and demand forecasts here: https://semiconductorinsight.com/report/semiconductor-front-end-equipment-market/
    SEMICONDUCTORINSIGHT.COM
    Semiconductor Front-End Equipment Market, Trends, Business Strategies 2025-2032
    Semiconductor Front-End Equipment Market was valued at 97070 million in 2024 and is projected to reach US$ 154250 million by 2032, at a CAGR of 7.2%
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  • Wafer Hybrid Bonding Machine Market Projected to Reach USD 850 Million by 2034 Amid 3D IC Surge
    Global Wafer Hybrid Bonding Machine market was valued at USD 150 million in 2024 and is forecasted to attain USD 850 million by 2034, registering a CAGR of 26.7% during 2026-2034. This acceleration stems from escalating needs for high-density interconnects in AI accelerators and advanced memory stacks.
    Wafer hybrid bonding machines execute dielectric-to-dielectric (SiO2) fusion with copper nano-pad compression at pitches under 1μm, achieving void-free bonds via plasma activation and annealing up to 300°C. These systems deliver alignment precisions below 100nm, enabling 10x higher I/O densities than TSVs while slashing resistance by 40% and power by 30%. Essential for stacking HBM dies with 100,000+ connections/mm², 3D logic-memory hybrids in HPC, CIS pixels at 0.7μm for automotive vision, and MEMS-photonics in LiDAR, they support 300mm wafers with throughputs over 50 pairs/hour.
    Access the complete industry analysis and demand forecasts here:
    https://semiconductorinsight.com/report/wafer-hybrid-bonding-machine-market/
    Wafer Hybrid Bonding Machine Market Projected to Reach USD 850 Million by 2034 Amid 3D IC Surge Global Wafer Hybrid Bonding Machine market was valued at USD 150 million in 2024 and is forecasted to attain USD 850 million by 2034, registering a CAGR of 26.7% during 2026-2034. This acceleration stems from escalating needs for high-density interconnects in AI accelerators and advanced memory stacks. Wafer hybrid bonding machines execute dielectric-to-dielectric (SiO2) fusion with copper nano-pad compression at pitches under 1μm, achieving void-free bonds via plasma activation and annealing up to 300°C. These systems deliver alignment precisions below 100nm, enabling 10x higher I/O densities than TSVs while slashing resistance by 40% and power by 30%. Essential for stacking HBM dies with 100,000+ connections/mm², 3D logic-memory hybrids in HPC, CIS pixels at 0.7μm for automotive vision, and MEMS-photonics in LiDAR, they support 300mm wafers with throughputs over 50 pairs/hour. 👉 Access the complete industry analysis and demand forecasts here: https://semiconductorinsight.com/report/wafer-hybrid-bonding-machine-market/
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  • SiC Crystal Substrate Market to Achieve USD 7,200 Million by 2034, Propelled by 8-Inch Wafer Scaling
    Global SiC Crystal Substrate Market was valued at USD 1,840 million in 2026 and is projected to reach USD 7,200 million by 2034, at a CAGR of 14.5% during 2026-2034. Growth stems from power device demand in EVs and renewables.
    SiC crystal substrates are synthetic single-crystal silicon carbide wafers, grown via physical vapor transport at over 2,000°C, available as conductive (n-type for MOSFETs) or semi-insulating (high-resistivity for RF), in 4-, 6-, and 8-inch diameters with defect densities under 1/cm². They underpin high-voltage devices enduring 900V+ and 200°C, slashing switching losses by 50% versus silicon, for traction inverters boosting EV range 5-7%, solar converters yielding 98% efficiency, and 5G amplifiers handling 10x power density.
    Access the complete industry analysis and demand forecasts here: https://semiconductorinsight.com/report/sic-crystal-substrate-market/
    SiC Crystal Substrate Market to Achieve USD 7,200 Million by 2034, Propelled by 8-Inch Wafer Scaling Global SiC Crystal Substrate Market was valued at USD 1,840 million in 2026 and is projected to reach USD 7,200 million by 2034, at a CAGR of 14.5% during 2026-2034. Growth stems from power device demand in EVs and renewables. SiC crystal substrates are synthetic single-crystal silicon carbide wafers, grown via physical vapor transport at over 2,000°C, available as conductive (n-type for MOSFETs) or semi-insulating (high-resistivity for RF), in 4-, 6-, and 8-inch diameters with defect densities under 1/cm². They underpin high-voltage devices enduring 900V+ and 200°C, slashing switching losses by 50% versus silicon, for traction inverters boosting EV range 5-7%, solar converters yielding 98% efficiency, and 5G amplifiers handling 10x power density. 👉 Access the complete industry analysis and demand forecasts here: https://semiconductorinsight.com/report/sic-crystal-substrate-market/
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  • Wafer Fab Equipment (WFE) Market to Reach USD 138,250 Million by 2034 Driven by Advanced Node

    The global Wafer Fab Equipment (WFE) Market was valued at USD 87,310 million in 2026 and is projected to reach USD 198,600 million by 2034, expanding at a CAGR of 7.8% during the forecast period 2026–2034. Market growth is being supported by advanced logic and memory node investments, capacity expansion in foundry and specialty fabs, and sustained capital expenditure in semiconductor manufacturing. The trend direction remains structurally upward with cyclical investment phases.
    Wafer Fab Equipment (WFE) refers to the set of manufacturing systems used in semiconductor fabrication facilities to process silicon wafers into integrated circuits. These tools span front-end and back-end processes including lithography, etch, deposition, ion implantation, cleaning, metrology, inspection, CMP, thermal processing, test, and packaging. WFE platforms are deployed across logic, foundry, DRAM, NAND, and specialty semiconductor production lines where process precision and yield control are critical.
    Access the complete industry analysis and demand forecasts here: https://semiconductorinsight.com/report/wafer-fab-equipment-wfe-market/
    Wafer Fab Equipment (WFE) Market to Reach USD 138,250 Million by 2034 Driven by Advanced Node The global Wafer Fab Equipment (WFE) Market was valued at USD 87,310 million in 2026 and is projected to reach USD 198,600 million by 2034, expanding at a CAGR of 7.8% during the forecast period 2026–2034. Market growth is being supported by advanced logic and memory node investments, capacity expansion in foundry and specialty fabs, and sustained capital expenditure in semiconductor manufacturing. The trend direction remains structurally upward with cyclical investment phases. Wafer Fab Equipment (WFE) refers to the set of manufacturing systems used in semiconductor fabrication facilities to process silicon wafers into integrated circuits. These tools span front-end and back-end processes including lithography, etch, deposition, ion implantation, cleaning, metrology, inspection, CMP, thermal processing, test, and packaging. WFE platforms are deployed across logic, foundry, DRAM, NAND, and specialty semiconductor production lines where process precision and yield control are critical. 👉 Access the complete industry analysis and demand forecasts here: https://semiconductorinsight.com/report/wafer-fab-equipment-wfe-market/
    AYEMA.NG
    Wafer Fab Equipment (WFE) Market, Global Outlook and Forecast...
    Wafer Fab Equipment (WFE) Market to Reach USD 138,250 Million by 2034 Driven by Advanced Node The global Wafer Fab Equipment (WFE) Market was valued at USD 87,310 million in 2026 and is projected to reach USD 198,600 million by 2034, expanding at a CAGR of 7.8% during the forecast period...
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  • Light Sources for Lithography Market Projected to Reach USD 4.3 Billion by 2034 Driven by EUV Adoption in Advanced Semiconductor Nodes

    Global Light Sources for Lithography Market was valued at USD 2.1 billion in 2026 and is projected to reach USD 4.3 billion by 2034, growing at a CAGR of 9.1% during the forecast period 2026–2034. Market expansion is being guided by steady technology-node migration and increased deployment of extreme ultraviolet systems across advanced semiconductor manufacturing lines.
    Light sources for lithography are core subsystems in semiconductor fabrication equipment used to transfer circuit patterns onto wafers with nanometer-level precision. These sources generate ultraviolet radiation at defined wavelengths, including deep ultraviolet (DUV) such as ArF (193nm), KrF (248nm), and i-line (365nm), as well as extreme ultraviolet (EUV) at 13.5nm. Selection of wavelength and source power directly influences resolution, throughput, and process control in logic, memory, and specialty device production.
    Access the complete industry analysis and demand forecasts here: https://semiconductorinsight.com/report/light-sources-for-lithography-market/
    Light Sources for Lithography Market Projected to Reach USD 4.3 Billion by 2034 Driven by EUV Adoption in Advanced Semiconductor Nodes Global Light Sources for Lithography Market was valued at USD 2.1 billion in 2026 and is projected to reach USD 4.3 billion by 2034, growing at a CAGR of 9.1% during the forecast period 2026–2034. Market expansion is being guided by steady technology-node migration and increased deployment of extreme ultraviolet systems across advanced semiconductor manufacturing lines. Light sources for lithography are core subsystems in semiconductor fabrication equipment used to transfer circuit patterns onto wafers with nanometer-level precision. These sources generate ultraviolet radiation at defined wavelengths, including deep ultraviolet (DUV) such as ArF (193nm), KrF (248nm), and i-line (365nm), as well as extreme ultraviolet (EUV) at 13.5nm. Selection of wavelength and source power directly influences resolution, throughput, and process control in logic, memory, and specialty device production. 👉 Access the complete industry analysis and demand forecasts here: https://semiconductorinsight.com/report/light-sources-for-lithography-market/
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  • CVD SiC Focus Ring Market to Reach USD 211 Million at CAGR of 11.3% Driven by Advanced Wafer Processing

    Global CVD SiC Focus Ring Market was valued at USD 102 million in 2026 and is projected to reach USD 211 million by 2034, registering a CAGR of 11.3% during the forecast period 2026–2034. Growth momentum remains aligned with expanding semiconductor fabrication capacity and the transition toward larger wafer formats and advanced plasma processing requirements.

    CVD SiC focus rings are silicon carbide-based chamber components used in semiconductor manufacturing equipment, particularly plasma etch and PECVD systems. These rings help maintain plasma uniformity, stabilize process conditions, and improve etch and deposition precision across wafer surfaces. Their high thermal conductivity, plasma resistance, and mechanical durability make them essential consumable parts in advanced-node and high-volume wafer fabrication environments.

    Access the complete industry analysis and demand forecasts here: https://semiconductorinsight.com/report/cvd-sic-focus-ring-market/
    CVD SiC Focus Ring Market to Reach USD 211 Million at CAGR of 11.3% Driven by Advanced Wafer Processing Global CVD SiC Focus Ring Market was valued at USD 102 million in 2026 and is projected to reach USD 211 million by 2034, registering a CAGR of 11.3% during the forecast period 2026–2034. Growth momentum remains aligned with expanding semiconductor fabrication capacity and the transition toward larger wafer formats and advanced plasma processing requirements. CVD SiC focus rings are silicon carbide-based chamber components used in semiconductor manufacturing equipment, particularly plasma etch and PECVD systems. These rings help maintain plasma uniformity, stabilize process conditions, and improve etch and deposition precision across wafer surfaces. Their high thermal conductivity, plasma resistance, and mechanical durability make them essential consumable parts in advanced-node and high-volume wafer fabrication environments. 👉 Access the complete industry analysis and demand forecasts here: https://semiconductorinsight.com/report/cvd-sic-focus-ring-market/
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  • Wafer OCD Measurement System Market to Reach USD 1.81 Billion by 2034 Driven by Advanced Node Fabrication and AI Chip Production

    Wafer OCD Measurement System Market to Reach USD 1.81 Billion by 2034 Driven by Advanced Node Fabrication and AI Chip Production
    Global Wafer OCD Measurement System Market was valued at USD 1,033 million in 2026 and is projected to reach USD 1,810 million by 2034, expanding at a CAGR of 8.6% during the forecast period. Market growth is being fueled by rapid advances in semiconductor process nodes.
    Wafer OCD (Optical Critical Dimension) measurement systems are precision metrology instruments used in semiconductor manufacturing to measure and analyze nanoscale features during wafer processing. These systems apply advanced optical and scatterometry-based techniques to evaluate parameters such as line width, pattern profile, and thin-film thickness, ensuring process control and yield optimization.
    For a detailed analysis of market drivers, restraints, opportunities, and the competitive strategies of key players, access the complete report.

    https://semiconductorinsight.com/report/wafer-ocd-measurement-system-market-size/
    Wafer OCD Measurement System Market to Reach USD 1.81 Billion by 2034 Driven by Advanced Node Fabrication and AI Chip Production Wafer OCD Measurement System Market to Reach USD 1.81 Billion by 2034 Driven by Advanced Node Fabrication and AI Chip Production Global Wafer OCD Measurement System Market was valued at USD 1,033 million in 2026 and is projected to reach USD 1,810 million by 2034, expanding at a CAGR of 8.6% during the forecast period. Market growth is being fueled by rapid advances in semiconductor process nodes. Wafer OCD (Optical Critical Dimension) measurement systems are precision metrology instruments used in semiconductor manufacturing to measure and analyze nanoscale features during wafer processing. These systems apply advanced optical and scatterometry-based techniques to evaluate parameters such as line width, pattern profile, and thin-film thickness, ensuring process control and yield optimization. For a detailed analysis of market drivers, restraints, opportunities, and the competitive strategies of key players, access the complete report. https://semiconductorinsight.com/report/wafer-ocd-measurement-system-market-size/
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  • Is that Possible for Wet Process Equipment Market to generate revenue of USD 11,900 Million by 2034..?

    Global Wet Process Equipment Market was valued at USD 6,730 million in 2026 and is projected to reach approximately USD 11,900 million by 2034, registering a CAGR of 5.87% during the forecast period 2026–2034. Demand is expanding steadily as semiconductor fabs increase investments in precision wafer cleaning and surface treatment technologies.
    Wet process equipment includes semiconductor manufacturing systems used for wafer cleaning, wet etching, stripping, rinsing, and surface conditioning using liquid chemistries. These tools are widely deployed across front-end fabrication and advanced packaging lines, including wafer cleaning systems, spin rinse dryers, wet etch stations, and plating platforms.
    Access the complete industry analysis and demand forecasts here: https://semiconductorinsight.com/report/wet-process-equipment-market/
    Is that Possible for Wet Process Equipment Market to generate revenue of USD 11,900 Million by 2034..? Global Wet Process Equipment Market was valued at USD 6,730 million in 2026 and is projected to reach approximately USD 11,900 million by 2034, registering a CAGR of 5.87% during the forecast period 2026–2034. Demand is expanding steadily as semiconductor fabs increase investments in precision wafer cleaning and surface treatment technologies. Wet process equipment includes semiconductor manufacturing systems used for wafer cleaning, wet etching, stripping, rinsing, and surface conditioning using liquid chemistries. These tools are widely deployed across front-end fabrication and advanced packaging lines, including wafer cleaning systems, spin rinse dryers, wet etch stations, and plating platforms. 👉 Access the complete industry analysis and demand forecasts here: https://semiconductorinsight.com/report/wet-process-equipment-market/
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  • Bare Chip Market Is Climbing Toward USD 10.5Billon — Explore What’s Fueling the Shift

     Global Bare Chip Market was valued at USD 4.67 billion in 2026 and is projected to reach approximately USD 10.5 billion by 2034, registering a CAGR of 8.4% during the forecast period 2026–2034. Market expansion is accelerating as advanced packaging, AI hardware, and high-density electronics increase direct die usage across industries.

    Bare chips, also known as semiconductor dies or wafer-form chips, are unpackaged semiconductor components used as foundational building blocks for integrated and hybrid circuits. They are deployed in formats such as Chip-on-Board (COB) and Flip Chip, enabling compact, high-performance assemblies across consumer electronics, automotive, telecom, and medical systems before final packaging integration.

    Access the complete industry analysis and demand forecasts here: http://semiconductorinsight.com/report/bare-chip-market/

    Bare Chip Market Is Climbing Toward USD 10.5Billon — Explore What’s Fueling the Shift  Global Bare Chip Market was valued at USD 4.67 billion in 2026 and is projected to reach approximately USD 10.5 billion by 2034, registering a CAGR of 8.4% during the forecast period 2026–2034. Market expansion is accelerating as advanced packaging, AI hardware, and high-density electronics increase direct die usage across industries. Bare chips, also known as semiconductor dies or wafer-form chips, are unpackaged semiconductor components used as foundational building blocks for integrated and hybrid circuits. They are deployed in formats such as Chip-on-Board (COB) and Flip Chip, enabling compact, high-performance assemblies across consumer electronics, automotive, telecom, and medical systems before final packaging integration. 👉 Access the complete industry analysis and demand forecasts here: http://semiconductorinsight.com/report/bare-chip-market/
    ·210 Vues ·0 Avis
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